Tiny Chiplets: A New Level of Micro Manufacturing
John Markoff of NYT looks at a crazy new wave of microchip/circuit processing:
The emerging printing technology poses a heretical idea: Rather than squeezing more transistors into the same small space, why not smear the transistors across a much larger surface?
And:
Eugene Chow is an electrical engineer who leads the PARC team that has designed the new technology that they have dubbed “Xerographic micro-assembly.” The technology breaks silicon wafers into tens of thousands of chiplets, bottles them as “ink” and then “prints” them, much as a Xerox laser printer puts toner on paper, he said.
Pair this with 3D printing and the possibilities seem insane.
